![TSMC and industry partners form 3DFabric Alliance focused on advancing chiplet architectures](https://static.techspot.com/images2/news/ts3_thumbs/2022/10/2022-10-29-ts3_thumbs-d9c.jpg)
The 3DFabric Alliance applies the combined expertise of multiple industry partners to create and refine chiplet-based design and packaging technologies. The 19-member alliance, which is expected to expand, spans the entire product ecosystem and includes partners specializing in design, automation, memory, substrate, test, and other areas of the manufacturing process....
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